产品特点

■适合于微加工

■整机风冷却方式

■新型半导体激光源，电光转换效率高，使用寿命长

■倍频转换的效率，较窄的激光脉冲宽度

■整机能耗低，免维护，可靠性高

Product features

● suitable for micromachining

●Air cooling

●New semiconductor laser source , high electricity-laser exchange ratio, long using lifetime

●Hgh efficiency frequency doubling conversion, narrow laser pulse width

●Low power consuming, maintenance free, stable performance

技术参数Technical parameter

输出功率 Laser power 6W/12W

激光波长 Wavelength 532nm

光束质量 Beam quality ㎡＜1.3

标刻范围 Marking scope 65×65/110×110/160×160mm(可选 optional)

标刻速度 Marking speed ≤7000mm/s

小线宽 line width 0.01mm

小字符 haracter 0.1mm

脉 宽 Pulse width 20ns(20KHz)

脉冲能量 Pulse energy 150μj(20KHz)

脉冲重复频率 Repeat precision 10-200KHz

供电电源 Power supply 220V±10% 50Hz/12A

整机功耗 Power Consumption 400W

工作温度 Working temperature 5℃--35℃

适用材料Applicable Materials

大多数金属和非金属的表面加工和镀层薄膜的加工；玻璃和水晶制品的表面雕刻。

Surface processing and coating film processing of most metal and non-metal materials. Surface engraving of glass and crystal products.

适用领域Applicable field

光学器件，手机屏，LCD屏，汽车玻璃，PCB板，陶瓷，硅片，塑料等行业

Optical device, mobile phone screen, LCD screen, car glass, PCB board, ceramic, silicon, plastic and so on

打印效果